Wire shaping is practical

Keyphrases

• Design Cost 100%
• Manufacturing Cost 100%
• Substantial Reduction 50%
• Silicon Wafer 50%
• Minimal Impact 50%
• Design Flow 50%
• Dynamic Power 50%
• Manufacturing Flow 50%
• GDSII 50%
• Power Minimization 50%
• Manufacturing for Design 50%
• Timing Closure 50%
• OPC Technology 50%

Engineering

• Manufacturing Cost 100%
• Experimental Result 50%
• Silicon Wafer 50%
• Interconnects 50%
• Design for Manufacture 50%