Wire shaping is practical

Hongbo Zhang; Martin D. F. Wong; Kai-Yuan Chao; Liang Deng

doi:10.1145/1514932.1514961

Wire shaping is practical

Hongbo Zhang, Martin D. F. Wong, Kai-Yuan Chao, Liang Deng

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

5 Citations (Scopus)

Abstract

Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using non-uniform wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping methodology. Non-uniform wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing OPC technology to accurately print non-uniform wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and non-uniform wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.

Original language	English
Title of host publication	ISPD '09
Subtitle of host publication	Proceedings of the 2009 International Symposium on Physical Design
Publisher	Association for Computing Machinery (ACM)
Pages	131-138
Number of pages	8
ISBN (Print)	9781605584492
DOIs	https://doi.org/10.1145/1514932.1514961
Publication status	Published - 29 Mar 2009
Event	18th International Symposium on Physical Design, ISPD 2009 - San Diego, United States Duration: 29 Mar 2009 → 1 Apr 2009 https://dl.acm.org/doi/proceedings/10.1145/1514932 (Conference proceedings)

Publication series

Name	Proceedings of the International Symposium on Physical Design, ISPD

Symposium

Symposium	18th International Symposium on Physical Design, ISPD 2009
Country/Territory	United States
City	San Diego
Period	29/03/09 → 1/04/09
Internet address	https://dl.acm.org/doi/proceedings/10.1145/1514932 (Conference proceedings)

User-Defined Keywords

Wire tapering
Power Minimization
Interconnect
OPC
Manufacturing for Design

Access to Document

10.1145/1514932.1514961

Cite this

@inproceedings{180dedc13f624e788f32db6a0caac530,

title = "Wire shaping is practical",

abstract = "Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using non-uniform wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping methodology. Non-uniform wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing OPC technology to accurately print non-uniform wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and non-uniform wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.",

keywords = "Wire tapering, Power Minimization, Interconnect, OPC, Manufacturing for Design",

author = "Hongbo Zhang and Wong, {Martin D. F.} and Kai-Yuan Chao and Liang Deng",

note = "This work was partially supported by the National Science Foundation under grant CCF-0701821 and a grant from the Semiconductor Research Corporation (SRC).; 18th International Symposium on Physical Design, ISPD 2009 ; Conference date: 29-03-2009 Through 01-04-2009",

year = "2009",

month = mar,

day = "29",

doi = "10.1145/1514932.1514961",

language = "English",

isbn = "9781605584492",

series = "Proceedings of the International Symposium on Physical Design, ISPD",

publisher = "Association for Computing Machinery (ACM)",

pages = "131--138",

booktitle = "ISPD '09",

address = "United States",

url = "https://dl.acm.org/doi/proceedings/10.1145/1514932",

}

Zhang, H, Wong, MDF, Chao, K-Y & Deng, L 2009, Wire shaping is practical. in ISPD '09: Proceedings of the 2009 International Symposium on Physical Design. Proceedings of the International Symposium on Physical Design, ISPD, Association for Computing Machinery (ACM), pp. 131-138, 18th International Symposium on Physical Design, ISPD 2009, San Diego, California, United States, 29/03/09. https://doi.org/10.1145/1514932.1514961

Wire shaping is practical. / Zhang, Hongbo; Wong, Martin D. F.; Chao, Kai-Yuan et al.
ISPD '09: Proceedings of the 2009 International Symposium on Physical Design. Association for Computing Machinery (ACM), 2009. p. 131-138 (Proceedings of the International Symposium on Physical Design, ISPD).

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

TY - GEN

T1 - Wire shaping is practical

AU - Zhang, Hongbo

AU - Wong, Martin D. F.

AU - Chao, Kai-Yuan

AU - Deng, Liang

N1 - This work was partially supported by the National Science Foundation under grant CCF-0701821 and a grant from the Semiconductor Research Corporation (SRC).

PY - 2009/3/29

Y1 - 2009/3/29

N2 - Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using non-uniform wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping methodology. Non-uniform wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing OPC technology to accurately print non-uniform wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and non-uniform wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.

AB - Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using non-uniform wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping methodology. Non-uniform wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing OPC technology to accurately print non-uniform wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and non-uniform wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.

KW - Wire tapering

KW - Power Minimization

KW - Interconnect

KW - OPC

KW - Manufacturing for Design

UR - http://www.scopus.com/inward/record.url?scp=70349089697&partnerID=8YFLogxK

U2 - 10.1145/1514932.1514961

DO - 10.1145/1514932.1514961

M3 - Conference proceeding

AN - SCOPUS:70349089697

SN - 9781605584492

T3 - Proceedings of the International Symposium on Physical Design, ISPD

SP - 131

EP - 138

BT - ISPD '09

PB - Association for Computing Machinery (ACM)

T2 - 18th International Symposium on Physical Design, ISPD 2009

Y2 - 29 March 2009 through 1 April 2009

ER -

Wire shaping is practical

Abstract

Publication series

Symposium

User-Defined Keywords

Access to Document

Other files and links

Fingerprint

Cite this