Wire shaping is practical

Hongbo Zhang, Martin D. F. Wong, Kai-Yuan Chao, Liang Deng

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

5 Citations (Scopus)


Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using non-uniform wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping methodology. Non-uniform wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing OPC technology to accurately print non-uniform wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and non-uniform wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.

Original languageEnglish
Title of host publicationISPD '09
Subtitle of host publicationProceedings of the 2009 International Symposium on Physical Design
PublisherAssociation for Computing Machinery (ACM)
Number of pages8
ISBN (Print)9781605584492
Publication statusPublished - 29 Mar 2009
Event18th International Symposium on Physical Design, ISPD 2009 - San Diego, United States
Duration: 29 Mar 20091 Apr 2009
https://dl.acm.org/doi/proceedings/10.1145/1514932 (Conference proceedings)

Publication series

NameProceedings of the International Symposium on Physical Design, ISPD


Symposium18th International Symposium on Physical Design, ISPD 2009
Country/TerritoryUnited States
CitySan Diego
Internet address

Scopus Subject Areas

  • Electrical and Electronic Engineering

User-Defined Keywords

  • Wire tapering
  • Power Minimization
  • Interconnect
  • OPC
  • Manufacturing for Design


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