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Thermal placement for high-performance multichip modules
Kai-Yuan Chao
,
D. F. Wong
Office of the Provost
Research output
:
Chapter in book/report/conference proceeding
›
Chapter
›
peer-review
23
Citations (Scopus)
Overview
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Dive into the research topics of 'Thermal placement for high-performance multichip modules'. Together they form a unique fingerprint.
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Keyphrases
High Performance
100%
Multichip Modules
100%
Thermal Placement
100%
Electrical Performance
66%
Placement Scheme
33%
Performance Requirements
33%
Thermal Behavior
33%
Thermal Model
33%
Placement Method
33%
Cooling Environment
33%
Convection Cooling
33%
Conduction Cooling
33%
Junction Temperature
33%
Conduction-convection
33%
Engineering
Multichip Modules
100%
Electrical Performance
66%
Thermal Behavior
33%
Performance Requirement
33%
Thermal Model
33%
Placement Method
33%
Junction Temperature
33%
Computer Science
Performance Requirement
100%
Thermal Behavior
100%