Abstract
A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.
| Original language | English |
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| Title of host publication | 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors |
| Publisher | IEEE |
| Pages | 218-223 |
| Number of pages | 6 |
| ISBN (Print) | 0818671653 |
| DOIs | |
| Publication status | Published - Oct 1995 |
| Event | 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors - Austin, United States Duration: 2 Oct 1995 → 4 Oct 1995 https://ieeexplore.ieee.org/xpl/conhome/4053/proceeding (Link to conference proceedings) |
Publication series
| Name | Proceedings of 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors |
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Conference
| Conference | 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors |
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| Country/Territory | United States |
| City | Austin |
| Period | 2/10/95 → 4/10/95 |
| Internet address |
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