Thermal placement for high-performance multichip modules

Kai-Yuan Chao; D. F. Wong

doi:10.1109/ICCD.1995.528813

Thermal placement for high-performance multichip modules

Kai-Yuan Chao, D. F. Wong

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Chapter › peer-review

23 Citations (Scopus)

Abstract

A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.

Original language	English
Title of host publication	1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors
Publisher	IEEE
Pages	218-223
Number of pages	6
ISBN (Print)	0818671653
DOIs	https://doi.org/10.1109/ICCD.1995.528813
Publication status	Published - Oct 1995
Event	1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors - Austin, United States Duration: 2 Oct 1995 → 4 Oct 1995 https://ieeexplore.ieee.org/xpl/conhome/4053/proceeding (Link to conference proceedings)

Publication series

Name	Proceedings of 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors

Conference

Conference	1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors
Country/Territory	United States
City	Austin
Period	2/10/95 → 4/10/95
Internet address	https://ieeexplore.ieee.org/xpl/conhome/4053/proceeding (Link to conference proceedings)

Access to Document

10.1109/ICCD.1995.528813

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Chao, K.-Y., & Wong, D. F. (1995). Thermal placement for high-performance multichip modules. In 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors (pp. 218-223). (Proceedings of 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors). IEEE. https://doi.org/10.1109/ICCD.1995.528813

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title = "Thermal placement for high-performance multichip modules",

abstract = "A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.",

author = "Kai-Yuan Chao and Wong, {D. F.}",

note = "Funding Information: This work was partially supported by Texas Advanced Research Program under Grant No. 003658459. Publisher Copyright: {\textcopyright} 1995 IEEE; 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors ; Conference date: 02-10-1995 Through 04-10-1995",

year = "1995",

month = oct,

doi = "10.1109/ICCD.1995.528813",

language = "English",

isbn = "0818671653",

series = "Proceedings of 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors",

publisher = "IEEE",

pages = "218--223",

booktitle = "1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors",

address = "United States",

url = "https://ieeexplore.ieee.org/xpl/conhome/4053/proceeding",

}

Chao, K-Y & Wong, DF 1995, Thermal placement for high-performance multichip modules. in 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors. Proceedings of 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors, IEEE, pp. 218-223, 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors, Austin, Texas, United States, 2/10/95. https://doi.org/10.1109/ICCD.1995.528813

Thermal placement for high-performance multichip modules. / Chao, Kai-Yuan; Wong, D. F.
1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors. IEEE, 1995. p. 218-223 (Proceedings of 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors).

Research output: Chapter in book/report/conference proceeding › Chapter › peer-review

TY - CHAP

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AU - Wong, D. F.

PY - 1995/10

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AB - A placement scheme that considers both electrical performance requirements and thermal behavior for the high-performance multichip modules is described in this paper. Practical thermal models are used for placement of high-speed chips in multichip module packages under two different cooling environments: conduction cooling and convection cooling. Placement methods are modified to optimize conventional electrical performance and chip junction temperatures.

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BT - 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors

PB - IEEE

T2 - 1995 IEEE International Conference on Computer Design, ICCD 1995: VLSI in Computers and Processors

Y2 - 2 October 1995 through 4 October 1995

ER -

Thermal placement for high-performance multichip modules

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