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Thermal-driven analog placement considering device matching
Mark Po-Hung Lin
, Hongbo Zhang
,
Martin D. F. Wong
, Yao-Wen Chang
Office of the Provost
Research output
:
Contribution to journal
›
Journal article
›
peer-review
28
Citations (Scopus)
Overview
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Dive into the research topics of 'Thermal-driven analog placement considering device matching'. Together they form a unique fingerprint.
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Keyphrases
Analog Circuits
50%
Analog Placement
100%
Circuit Performance
50%
Common Centroid
25%
Devices Matching
100%
Electrical Characteristics
25%
Performance Accuracy
25%
Power Device
25%
Power-sensitive
25%
Result-oriented
25%
Sensitive Device
50%
Thermal Driving
100%
Thermal Effect
25%
Thermal Gradient
25%
Thermal Impact
25%
Thermal Matching
25%
Thermal Profile
100%
Thermally Induced
25%
Thermally Sensitive
50%
Engineering
Analog Circuit
100%
Circuit Performance
100%
Experimental Result
50%
Power Device
50%
Thermal Effect
50%
Thermal Gradient
50%
Thermal Impact
50%
Computer Science
Analog Circuit
50%
Experimental Result
25%
Thermal Gradient
25%
Thermal Profile
100%