Thermal-driven analog placement considering device matching

Po-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-Wen Chang

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

26 Citations (Scopus)

Abstract

With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

Original languageEnglish
Title of host publication46th ACM/IEEE Design Automation Conference - Proceedings 2009
PublisherAssociation for Computing Machinery (ACM)
Pages593-598
Number of pages6
ISBN (Print)9781605584973
DOIs
Publication statusPublished - 29 Jul 2009
Event46th ACM/IEEE Design Automation Conference, DAC 2009 - San Francisco, United States
Duration: 26 Jul 200931 Jul 2009
https://www.dac.com/About/Conference-Archive/46th-DAC-2009 (Conference website)
https://www.dac.com/portals/0/documents/archive/2009/46DAC_Final_Prgm.pdf (Conference programme )
https://dl.acm.org/doi/proceedings/10.1145/1629911 (Conference proceedings)
https://ieeexplore.ieee.org/xpl/conhome/5209519/proceeding

Publication series

NameACM/IEEE Design Automation Conference - Proceedings
ISSN (Print)0738-100X

Conference

Conference46th ACM/IEEE Design Automation Conference, DAC 2009
Country/TerritoryUnited States
CitySan Francisco
Period26/07/0931/07/09
Internet address

Scopus Subject Areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Modelling and Simulation
  • Electrical and Electronic Engineering

User-Defined Keywords

  • Analog placement
  • Thermal matching

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