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Temperature-aware placement for SOCs
Jeng-Llang Tsai
*
, C.C.-P. Chen
, Guoqiang Chen
, B. Goplen
, Haifeng Qian
, Yong Zhan
, Sung-Mo Kang
,
M. D. F. Wong
, S. S. Sapatnekar
*
Corresponding author for this work
Office of the Provost
Research output
:
Contribution to journal
›
Journal article
›
peer-review
49
Citations (Scopus)
Overview
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Keyphrases
Temperature Sensing
100%
Placement Algorithm
100%
Thermal Modeling
100%
Two Dimensional
50%
Three-dimensional (3D)
50%
High Temperature
50%
Thermal Analysis
50%
Temperature Effect
50%
Modeling Method
50%
Function-based
50%
Power Consumption
50%
Failure Time
50%
Simulated Annealing
50%
Random Walk
50%
Reliability Issues
50%
Green's Function
50%
Simulation Method
50%
Placement Optimization
50%
Integration Density
50%
Temperature Distribution
50%
System-on-chip
50%
Chip-level
50%
Thermal-aware
50%
Force-directed
50%
Thermal Simulation
50%
Finite Element Model Reduction
50%
Timing Failures
50%
Time Domain Finite Element
50%
Tapeout
50%
Thermal Integrity
50%
Finite-difference Time-domain
50%
Matrix Synthesis
50%
Power Integration
50%
Engineering
Two Dimensional
100%
Future Trend
100%
Time Domain
100%
Electric Power Utilization
100%
Finite Element Modeling
100%
Green's Functions
100%
Model Reduction
100%
Simulation Method
100%
System-on-Chip
100%
Reliability Issue
100%
Temperature Distribution
100%
Matrix Synthesis
100%
Computer Science
Placement Algorithm
100%
Power Consumption
50%
Simulated Annealing
50%
Random Walk
50%
Finite Element Analysis
50%
Modeling and Simulation
50%
System-on-Chip
50%
Finite-Difference Time-Domain Method
50%
Finite-Difference Time-Domain (FDTD)
50%
Temperature Distribution
50%