Structural and optical properties of polycrystalline silicon thin films deposited by PECVD method

  • Furong Zhu*
  • , Hajime Kohara
  • , Takashi Fuyuki
  • , Hiroyuki Matsunami
  • *Corresponding author for this work

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

1 Citation (Scopus)

Abstract

Polycrystalline silicon (Si) films have been deposited on both Si and foreign substrates by the plasma enhanced chemical vapour deposition (PECVD) method. Structural properties of Si films were characterised by X-ray diffraction (XRD) and Raman scattering measurements. Optical constants of Si films were calculated using the optical admittance method. The crystallinity of the films prepared at different temperatures is investigated. Results reveal that over 90% of the Si was in a polycrystalline structure in the films when the deposition temperature was over 800°C.

Original languageEnglish
Title of host publicationConference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996
PublisherIEEE
Pages709-712
Number of pages4
ISBN (Print)0780331664
DOIs
Publication statusPublished - 13 May 1996
Event1996 25th IEEE Photovoltaic Specialists Conference - Washington, DC, USA
Duration: 13 May 199617 May 1996

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
PublisherIEEE
ISSN (Print)0160-8371

Conference

Conference1996 25th IEEE Photovoltaic Specialists Conference
CityWashington, DC, USA
Period13/05/9617/05/96

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

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