Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography

Yuelin Du; Qiang Ma; Hua Song; James Shiely; Gerard Luk-Pat; Alexander Miloslavsky; Martin D.F. Wong

doi:10.1145/2463209.2488848

Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography

Yuelin Du^*, Qiang Ma, Hua Song, James Shiely, Gerard Luk-Pat, Alexander Miloslavsky, Martin D.F. Wong

^*Corresponding author for this work

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Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

31 Citations (Scopus)

Abstract

Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.

Original language	English
Title of host publication	50th ACM/IEEE Design Automation Conference 2013
Pages	1-6
Number of pages	6
DOIs	https://doi.org/10.1145/2463209.2488848
Publication status	Published - 29 May 2013
Event	50th ACM/IEEE Design Automation Conference, DAC 2013 - Austin, United States Duration: 29 May 2013 → 7 Jun 2013 https://www.dac.com/About/Conference-Archive/50th-DAC-2013 (Conference website) https://dl.acm.org/doi/proceedings/10.1145/2463209 (Conference proceedings) https://ieeexplore.ieee.org/xpl/conhome/6556118/proceeding (Conference proceedings)

Publication series

Name	Proceedings of ACM/IEEE Design Automation Conference
ISSN (Print)	0738-100X

Conference

Conference	50th ACM/IEEE Design Automation Conference, DAC 2013
Country/Territory	United States
City	Austin
Period	29/05/13 → 7/06/13
Internet address	https://www.dac.com/About/Conference-Archive/50th-DAC-2013 (Conference website) https://dl.acm.org/doi/proceedings/10.1145/2463209 (Conference proceedings) https://ieeexplore.ieee.org/xpl/conhome/6556118/proceeding (Conference proceedings)

Scopus Subject Areas

Computer Science Applications
Control and Systems Engineering
Electrical and Electronic Engineering
Modelling and Simulation

User-Defined Keywords

SADP
SID-compliant detailed routing

Access to Document

10.1145/2463209.2488848

Cite this

@inproceedings{525548403d2d4871b8b13105a0dd3134,

title = "Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography",

abstract = "Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.",

keywords = "SADP, SID-compliant detailed routing",

author = "Yuelin Du and Qiang Ma and Hua Song and James Shiely and Gerard Luk-Pat and Alexander Miloslavsky and Wong, {Martin D.F.}",

note = "Publisher copyright: {\textcopyright} 2013 ACM; 50th ACM/IEEE Design Automation Conference, DAC 2013 ; Conference date: 29-05-2013 Through 07-06-2013",

year = "2013",

month = may,

day = "29",

doi = "10.1145/2463209.2488848",

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url = "https://www.dac.com/About/Conference-Archive/50th-DAC-2013, https://dl.acm.org/doi/proceedings/10.1145/2463209, https://ieeexplore.ieee.org/xpl/conhome/6556118/proceeding",

}

Du, Y, Ma, Q, Song, H, Shiely, J, Luk-Pat, G, Miloslavsky, A & Wong, MDF 2013, Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. in 50th ACM/IEEE Design Automation Conference 2013., 93, Proceedings of ACM/IEEE Design Automation Conference, pp. 1-6, 50th ACM/IEEE Design Automation Conference, DAC 2013, Austin, Texas, United States, 29/05/13. https://doi.org/10.1145/2463209.2488848

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T1 - Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography

AU - Du, Yuelin

AU - Ma, Qiang

AU - Song, Hua

AU - Shiely, James

AU - Luk-Pat, Gerard

AU - Miloslavsky, Alexander

AU - Wong, Martin D.F.

PY - 2013/5/29

Y1 - 2013/5/29

N2 - Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.

AB - Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.

KW - SADP

KW - SID-compliant detailed routing

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ER -

Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography

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