Abstract
Pad assignment with signal integrity optimization is very important for high-speed VLSI design. In this paper, an efficient method is proposed to effectively minimize both simultaneous switching noise and crosstalk that are inevitably caused by package inductance and capacitance during the design of high-speed/high-bandwidth circuits. Due to its efficiency, our algorithm can be incorporated into existing circuit floorplanning and placement schemes for the co-design of VLSI and packaging. For a set of industrial circuits/packages tested in our experiment, on the average, our method achieves a 16.8% reduction of total electrical noise when compared with the conventional design rule of thumb popularly used by circuit designers.
Original language | English |
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Title of host publication | 1995 IEEE International Conference on Computer-Aided Design, ICCAD 1995 |
Publisher | IEEE |
Pages | 720-725 |
Number of pages | 6 |
ISBN (Print) | 0818672137, 0818682000 |
DOIs | |
Publication status | Published - Nov 1995 |
Event | 1995 IEEE International Conference on Computer-Aided Design, ICCAD 1995 - San Jose, United States Duration: 5 Nov 1995 → 9 Nov 1995 https://ieeexplore.ieee.org/xpl/conhome/3472/proceeding (Link to conference proceedings) |
Publication series
Name | Proceedings of 1995 IEEE International Conference on Computer-Aided Design, ICCAD 1995 |
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Conference
Conference | 1995 IEEE International Conference on Computer-Aided Design, ICCAD 1995 |
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Country/Territory | United States |
City | San Jose |
Period | 5/11/95 → 9/11/95 |
Internet address |
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Scopus Subject Areas
- Software
- Computer Science Applications
- Computer Graphics and Computer-Aided Design