Shuttle Mask Floorplanning

Gang Xu, Ruiqi Tian, D. F. Wong, Alfred Reich

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

20 Citations (Scopus)


A shuttle mask has different chips on the same mask. The chips are not electrically connected. Alliance and foundry customers can utilize shuttle masks to share the rising cost of mask and wafer manufacturing. This paper studies the shuttle mask floorplan problem, which is formulated as a rectangle-packing problem with constraints of final die sawing strategy and die-to-die mask inspection. For our formulation, we offer a "merging" method that reduces the problem to an unconstrained slicing floorplan problem. Excellent results are obtained from the experiment with real industry data. We also study a "general" method and discuss the reason why it does not work very well.

Original languageEnglish
Title of host publication23rd Annual BACUS Symposium on Photomask Technology
EditorsKurt R. Kimmel, Wolfgang Staud
Number of pages10
Publication statusPublished - Sept 2003
Event23rd Annual BACUS Symposium on Photomask Technology - Monterey, United States
Duration: 9 Sept 200312 Sept 2003

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


Conference23rd Annual BACUS Symposium on Photomask Technology
Country/TerritoryUnited States
Internet address

Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

User-Defined Keywords

  • Floorplanning
  • Merging method
  • Shuttle mask
  • Simulated annealing


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