Abstract
A shuttle mask has different chips on the same mask. The chips are not electrically connected. Alliance and foundry customers can utilize shuttle masks to share the rising cost of mask and wafer manufacturing. This paper studies the shuttle mask floorplan problem, which is formulated as a rectangle-packing problem with constraints of final die sawing strategy and die-to-die mask inspection. For our formulation, we offer a "merging" method that reduces the problem to an unconstrained slicing floorplan problem. Excellent results are obtained from the experiment with real industry data. We also study a "general" method and discuss the reason why it does not work very well.
Original language | English |
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Title of host publication | 23rd Annual BACUS Symposium on Photomask Technology |
Editors | Kurt R. Kimmel, Wolfgang Staud |
Publisher | SPIE |
Pages | 185-194 |
Number of pages | 10 |
DOIs | |
Publication status | Published - Sept 2003 |
Event | 23rd Annual BACUS Symposium on Photomask Technology - Monterey, United States Duration: 9 Sept 2003 → 12 Sept 2003 https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5256.toc |
Publication series
Name | Proceedings of SPIE - The International Society for Optical Engineering |
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Publisher | SPIE |
Volume | 5256 |
ISSN (Print) | 0277-786X |
Conference
Conference | 23rd Annual BACUS Symposium on Photomask Technology |
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Country/Territory | United States |
City | Monterey |
Period | 9/09/03 → 12/09/03 |
Internet address |
User-Defined Keywords
- Floorplanning
- Merging method
- Shuttle mask
- Simulated annealing