SDM-PEB: Spatial-Depthwise Mamba for Enhanced Post-Exposure Bake Simulation

  • Ziyang Yu*
  • , Peng Xu
  • , Zixiao Wang
  • , Binwu Zhu
  • , Qipan Wang
  • , Yibo Lin
  • , Runsheng Wang
  • , Bei Yu
  • , Martin Wong
  • *Corresponding author for this work

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

Abstract

The post-exposure bake (PEB) process is a critical step in semiconductor lithography, directly impacting resist profile accuracy and circuit pattern fidelity. Precise modeling of PEB is essential for controlling photoacid diffusion and inhibitor reactions. In this paper, we introduce SDM-PEB, an advanced modeling framework designed to enhance the accuracy of PEB simulations by capturing both intra-layer spatial dependencies and inter-layer depthwise interactions. Leveraging a unique hierarchical feature extractor with overlapped patch merging and efficient self-attention, our approach effectively captures both coarse and fine features at multiple scales. The spatial-depthwise Mamba-based attention unit, centered on a customized selective scan and structured state space model, efficiently captures spatial and depthwise dependencies, enabling precise 3D PEB simulation. Additionally, a PEB focal loss and differential depth divergence regularization term improve the sensitivity to both spatial and depthwise variations, addressing inherent data imbalances in 3D PEB simulations. Our framework is validated with commercial rigorous model, and experimental results demonstrate that the SDM-PEB outperforms previous methods in accuracy and efficiency.

Original languageEnglish
Title of host publication2025 62nd ACM/IEEE Design Automation Conference, DAC 2025
PublisherIEEE
Number of pages7
ISBN (Electronic)9798331503048
ISBN (Print)9798331503055
DOIs
Publication statusPublished - 22 Jun 2025
Event62nd ACM/IEEE Design Automation Conference, DAC 2025 - San Francisco, United States
Duration: 22 Jun 202525 Jun 2025

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Conference

Conference62nd ACM/IEEE Design Automation Conference, DAC 2025
Country/TerritoryUnited States
CitySan Francisco
Period22/06/2525/06/25

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