Porosification-induced back-bond weakening in chemical etching of n-Si(111)

Engineering & Materials Science

• Etching 100%
• Metals 26%
• Nanowires 25%
• Silicon 24%
• Catalysis 13%
• Optoelectronic devices 12%
• Crystalline materials 10%
• Evaporation 10%
• Thermodynamics 8%
• Electronic equipment 8%
• Heating 7%
• Engineers 7%
• Sensors 5%
• Temperature 4%

Physics & Astronomy

• etching 70%
• stirring 24%
• silicon 16%
• nanowires 16%
• metals 15%
• sinking 14%
• metal particles 12%
• catalysis 11%
• engineers 10%
• evaporation 7%
• deviation 7%
• thermodynamics 7%
• heating 6%
• sensors 6%
• room temperature 5%
• electronics 5%

Chemical Compounds

• Etching 83%
• Meso Porosity 32%
• Nanowire 17%
• Evaporation 9%
• Catalysis 6%
• Surface 6%
• Thermodynamics 6%
• Ambient Reaction Temperature 5%
• Metal 4%