FinFET transistors have great advantages over traditional planar MOSFET transistors in high performance and low power applications. Major foundries are adopting the Fin-FET technology for CMOS semiconductor device fabrication in the 16 nm technology node and beyond. Edge device degradation is among the major challenges for the FinFET process. To avoid such degradation, dummy gates are needed on device edges, and the dummy gates have to be tied to power rails in order not to introduce unconnected parasitic transistors. This requires that each dummy gate must abut at least one source node after standard cell placement. If the drain nodes at two adjacent cell boundaries abut each other, additional source nodes must be inserted in between for dummy gate power tying, which costs more placement area. Usually there is some flexibility during detailed placement to horizontally flip the cells or switch the positions of adjacent cells, which has little impact on the global placement objectives, such as timing conditions and net congestion. This paper proposes a detailed placement optimization strategy for the standard cell based designs. By flipping a subset of cells in a standard cell row and switching pairs of adjacent cells, the number of drain to drain abutments between adjacent cell boundaries can be optimally minimized, which saves additional source node insertion and reduces the length of the standard cell row. In addition, the proposed graph model can be easily modified to consider more complicated design rules. The experimental results show that the optimization of 100k cells is completed within 0.1 second, verifying the efficiency of the proposed algorithm.
|Proceedings of Design, Automation & Test in Europe Conference & Exhibition (DATE)
|2014 Design, Automation & Test in Europe Conference & Exhibition, DATE 2014
|24/03/14 → 28/03/14