Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models

Leslie K. Hwang; Beomjin Kwon; Martin D.F. Wong

doi:10.1109/ITHERM.2019.8757254

Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models

Leslie K. Hwang, Beomjin Kwon, Martin D.F. Wong

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

7 Citations (Scopus)

Abstract

In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10^{- 8} m³/s and heat flux of 100 W/cm² for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.

Original language	English
Title of host publication	Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Publisher	IEEE
Pages	1197-1203
Number of pages	7
ISBN (Electronic)	9781728124612, 9781728124605
ISBN (Print)	9781728124629
DOIs	https://doi.org/10.1109/ITHERM.2019.8757254
Publication status	Published - May 2019
Event	18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 - Las Vegas, United States Duration: 28 May 2019 → 31 May 2019 https://ieeexplore.ieee.org/xpl/conhome/8747321/proceeding

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume	2019-May
ISSN (Print)	1087-9870
ISSN (Electronic)	2577-0799

Conference

Conference	18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Country/Territory	United States
City	Las Vegas
Period	28/05/19 → 31/05/19
Internet address	https://ieeexplore.ieee.org/xpl/conhome/8747321/proceeding

Scopus Subject Areas

Control and Systems Engineering
Electrical and Electronic Engineering

User-Defined Keywords

3D IC
Complete channel model
Converging channel
Diverging channel
MicroChannel optimization

Access to Document

10.1109/ITHERM.2019.8757254

Cite this

Hwang, L. K., Kwon, B., & Wong, M. D. F. (2019). Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. In Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 (pp. 1197-1203). Article 8757254 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2019-May). IEEE. https://doi.org/10.1109/ITHERM.2019.8757254

Hwang, Leslie K. ; Kwon, Beomjin ; Wong, Martin D.F. / Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE, 2019. pp. 1197-1203 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

@inproceedings{59705f28c74645ceb2c2c47d31b92f44,

title = "Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models",

abstract = "In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10- 8 m3/s and heat flux of 100 W/cm2 for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.",

keywords = "3D IC, Complete channel model, Converging channel, Diverging channel, MicroChannel optimization",

author = "Hwang, {Leslie K.} and Beomjin Kwon and Wong, {Martin D.F.}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE; 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 ; Conference date: 28-05-2019 Through 31-05-2019",

year = "2019",

month = may,

doi = "10.1109/ITHERM.2019.8757254",

language = "English",

isbn = "9781728124629",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

publisher = "IEEE",

pages = "1197--1203",

booktitle = "Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019",

address = "United States",

url = "https://ieeexplore.ieee.org/xpl/conhome/8747321/proceeding",

}

Hwang, LK, Kwon, B & Wong, MDF 2019, Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. in Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019., 8757254, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2019-May, IEEE, pp. 1197-1203, 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019, Las Vegas, United States, 28/05/19. https://doi.org/10.1109/ITHERM.2019.8757254

Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. / Hwang, Leslie K.; Kwon, Beomjin; Wong, Martin D.F.
Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE, 2019. p. 1197-1203 8757254 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2019-May).

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

TY - GEN

T1 - Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models

AU - Hwang, Leslie K.

AU - Kwon, Beomjin

AU - Wong, Martin D.F.

PY - 2019/5

Y1 - 2019/5

N2 - In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10- 8 m3/s and heat flux of 100 W/cm2 for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.

AB - In spite of the various aspects of thermal-aware designs in 3D IC, the thermal barrier is yet to overcome to enable the technology. As liquid cooling microchannel is highly effective means in thermal management, it has been rising as a promising technique to integrate into 3D IC. To attain the feasibility, it is crucial to design low-power and highly-efficient microchannel in compact chip packaging. In this work, we derive complete closed-form correlations which accurately model converging, diverging and uniform microchannels. We use microchannel designs of width 10-600 μm, tapering angle of -11-20° with Reynolds number of 39-99, inlet volumetric flow rate of 10- 8 m3/s and heat flux of 100 W/cm2 for the derivation. Then, we optimize the microchannel design to maximize the thermal performance while constraining pumping power and channel widths. Optimization is based on our derived correlations for heat transfer and pressure drop and the resulting microchannel designs are validated with numerical simulations. Temperature maps of the optimized channels from numerical simulation demonstrate accurate estimation of overall thermal resistance and proves the reliability of the optimization.

KW - 3D IC

KW - Complete channel model

KW - Converging channel

KW - Diverging channel

KW - MicroChannel optimization

UR - http://www.scopus.com/inward/record.url?scp=85073913096&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2019.8757254

DO - 10.1109/ITHERM.2019.8757254

M3 - Conference proceeding

AN - SCOPUS:85073913096

SN - 9781728124629

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 1197

EP - 1203

BT - Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019

PB - IEEE

T2 - 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019

Y2 - 28 May 2019 through 31 May 2019

ER -

Hwang LK, Kwon B, Wong MDF. Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models. In Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE. 2019. p. 1197-1203. 8757254. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2019.8757254

Optimization of Liquid Cooling MicroChannel in 3D IC using Complete Converging and Diverging Channel Models

Abstract

Publication series

Conference

Scopus Subject Areas

User-Defined Keywords

Access to Document

Other files and links

Fingerprint

Cite this