On a Moreau Envelope Wirelength Model for Analytical Global Placement

Peiyu Liao; Hongduo Liu; Yibo Lin; Bei Yu; Martin Wong

doi:10.1109/DAC56929.2023.10247712

On a Moreau Envelope Wirelength Model for Analytical Global Placement

Peiyu Liao, Hongduo Liu, Yibo Lin^*, Bei Yu^*, Martin Wong

^*Corresponding author for this work

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

4 Citations (Scopus)

Abstract

Analytical placement is proven to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that our proposed algorithm can achieve up to 5.4% HPWL improvement and more than 1% on average compared to the most widely-used nonlinear wirelength model.

Original language	English
Title of host publication	60th ACM/IEEE Design Automation Conference - Proceedings 2023
Publisher	IEEE
Pages	1-6
Number of pages	6
ISBN (Electronic)	9798350323481
ISBN (Print)	9798350323498
DOIs	https://doi.org/10.1109/DAC56929.2023.10247712
Publication status	Published - 13 Jul 2023
Event	60th ACM/IEEE Design Automation Conference, DAC 2023 - Moscone West, San Francisco, United States Duration: 9 Jul 2023 → 13 Jul 2023 https://www.dac.com/ https://60dac.conference-program.com/ https://ieeexplore.ieee.org/xpl/conhome/10247654/proceeding

Publication series

Name	ACM/IEEE Design Automation Conference - Proceedings
Volume	2023-July
ISSN (Print)	0738-100X

Conference

Conference	60th ACM/IEEE Design Automation Conference, DAC 2023
Country/Territory	United States
City	San Francisco
Period	9/07/23 → 13/07/23
Internet address	https://www.dac.com/ https://60dac.conference-program.com/ https://ieeexplore.ieee.org/xpl/conhome/10247654/proceeding

Scopus Subject Areas

Electrical and Electronic Engineering
Control and Systems Engineering
Computer Science Applications
Modelling and Simulation

User-Defined Keywords

Analytical models
Approximation algorithms
Approximation error
Benchmark testing
Design automation
Graphics processing units
Runtime

Access to Document

10.1109/DAC56929.2023.10247712

Cite this

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title = "On a Moreau Envelope Wirelength Model for Analytical Global Placement",

abstract = "Analytical placement is proven to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that our proposed algorithm can achieve up to 5.4% HPWL improvement and more than 1% on average compared to the most widely-used nonlinear wirelength model.",

keywords = "Analytical models, Approximation algorithms, Approximation error, Benchmark testing, Design automation, Graphics processing units, Runtime",

author = "Peiyu Liao and Hongduo Liu and Yibo Lin and Bei Yu and Martin Wong",

note = "Funding Information: This work is supported by The Research Grants Council of Hong Kong SAR (No. CUHK14209420), National Science Fundation of China (No. 62141404), and The 111 Project (No. B18001). Publisher Copyright: {\textcopyright} 2023 IEEE.; 60th ACM/IEEE Design Automation Conference, DAC 2023 ; Conference date: 09-07-2023 Through 13-07-2023",

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series = "ACM/IEEE Design Automation Conference - Proceedings",

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Liao, P, Liu, H, Lin, Y, Yu, B & Wong, M 2023, On a Moreau Envelope Wirelength Model for Analytical Global Placement. in 60th ACM/IEEE Design Automation Conference - Proceedings 2023. ACM/IEEE Design Automation Conference - Proceedings, vol. 2023-July, IEEE, pp. 1-6, 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, California, United States, 9/07/23. https://doi.org/10.1109/DAC56929.2023.10247712

On a Moreau Envelope Wirelength Model for Analytical Global Placement. / Liao, Peiyu; Liu, Hongduo; Lin, Yibo et al.
60th ACM/IEEE Design Automation Conference - Proceedings 2023. IEEE, 2023. p. 1-6 (ACM/IEEE Design Automation Conference - Proceedings; Vol. 2023-July).

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

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AU - Yu, Bei

AU - Wong, Martin

N1 - Funding Information: This work is supported by The Research Grants Council of Hong Kong SAR (No. CUHK14209420), National Science Fundation of China (No. 62141404), and The 111 Project (No. B18001). Publisher Copyright: © 2023 IEEE.

PY - 2023/7/13

Y1 - 2023/7/13

N2 - Analytical placement is proven to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that our proposed algorithm can achieve up to 5.4% HPWL improvement and more than 1% on average compared to the most widely-used nonlinear wirelength model.

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KW - Analytical models

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KW - Approximation error

KW - Benchmark testing

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KW - Runtime

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On a Moreau Envelope Wirelength Model for Analytical Global Placement

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