Model-based dummy feature placement for oxide chemical-mechanical polishing manufacturability

Ruiqi Tian, D. F. Wong, Robert Boone

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

45 Citations (Scopus)

Abstract

Chemical-mechanical polishing (CMP) is an enabling technique used in deep-submicron VLSI manufacturing to achieve uniformity in long range oxide planarization. Post-CMP oxide topography is highly related to local spatial pattern density in layout. To change local pattern density, and thus ensure post-CMP planarization, dummy features are placed in layout. Based on models that accurately describe the relation between local pattern density and post-CMP planarization, a two-step procedure of global density assignment followed by local insertion is proposed to solve the dummy feature placement problem in the fixed-dissection regime with both single-layer and multiple-layer considerations. Two experiments, conducted with real design data, gave excellent results by reducing post-CMP topography variation from 767 angstrom to 152 angstrom in the single-layer formulation and by avoiding cumulative effect in the multiple-layer formulation. The result from single-layer formulation compares very favorably both to the rule-based approach widely used in industry and to the algorithm in [3]. The multiple-layer formulation has no previously published work.

Original languageEnglish
Title of host publication37th ACM/IEEE Design Automation Conference - Proceedings 2000
PublisherAssociation for Computing Machinery (ACM)
Pages667-670
Number of pages4
ISBN (Print)9781581131871, 1581131879
DOIs
Publication statusPublished - 5 Jun 2000
Event37th ACM/IEEE-CAS/EDAC Design Automation Conference, DAC 2000 - Los Angeles, United States
Duration: 5 Jun 20009 Jun 2000
https://dl.acm.org/doi/proceedings/10.1145/337292 (Conference proceedings)
https://ieeexplore.ieee.org/xpl/conhome/6899/proceeding (Conference proceedings)

Publication series

NameProceedings - ACM/IEEE Design Automation Conference, DAC
ISSN (Print)0738-100X

Conference

Conference37th ACM/IEEE-CAS/EDAC Design Automation Conference, DAC 2000
Country/TerritoryUnited States
CityLos Angeles
Period5/06/009/06/00
Internet address

Scopus Subject Areas

  • Hardware and Architecture
  • Control and Systems Engineering

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