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Method and Apparatus for Measuring Amount of Material Removed from Target in Pulsed Laser Ablation (Granted)

  • Yue CAI (Inventor)
  • , Po Chun CHU (Inventor)
  • , Nai Ho CHEUNG (Inventor)

Research output: Patent

Original languageEnglish
Patent numberUS 8,671,759 B2
IPCG01-CY-Meth-US01
Filing date28/07/11
Publication statusPublished - 31 Jan 2013

User-Defined Keywords

  • Ablation
  • Material
  • Measurement
  • Pulsed Laser
  • Removed

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