Layer assignment for high-performance multi-chip modules

Kai-Yuan Chao; D. F. Wong

doi:10.1109/ICCAD.1994.629895

Layer assignment for high-performance multi-chip modules

Kai-Yuan Chao, D. F. Wong

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Research output: Chapter in book/report/conference proceeding › Chapter › peer-review

1 Citation (Scopus)

Abstract

In this paper, we present a layer assignment method for high-performance multi-chip module environments. In contrast with treating global routing and layer assignment separately, our method assigns nets to layers while considering preferable global routing topologies simultaneously. We take transmission line effects into account to avoid noise in high-speed circuit packages. The problem is formulated as a quadratic Boolean programming problem and an algorithm is presented to solve the problem after linearization. Our method is applied to a set of benchmark circuits to demonstrate the effectiveness.

Original language	English
Title of host publication	1994 IEEE/ACM International Conference On Computer-aided Design, ICCAD 1994
Publisher	IEEE
Pages	680-685
Number of pages	6
ISBN (Print)	0818664177, 0818630108
DOIs	https://doi.org/10.1109/ICCAD.1994.629895
Publication status	Published - Nov 1994
Event	1994 IEEE/ACM International Conference on Computer-aided Design, ICCAD 1994 - San Jose, United States Duration: 6 Nov 1994 → 10 Nov 1994 https://ieeexplore.ieee.org/xpl/conhome/4983/proceeding (Link to conference proceedings)

Publication series

Name	Proceedings of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Conference

Conference	1994 IEEE/ACM International Conference on Computer-aided Design, ICCAD 1994
Country/Territory	United States
City	San Jose
Period	6/11/94 → 10/11/94
Internet address	https://ieeexplore.ieee.org/xpl/conhome/4983/proceeding (Link to conference proceedings)

Scopus Subject Areas

Software
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

Access to Document

10.1109/ICCAD.1994.629895

Cite this

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title = "Layer assignment for high-performance multi-chip modules",

abstract = "In this paper, we present a layer assignment method for high-performance multi-chip module environments. In contrast with treating global routing and layer assignment separately, our method assigns nets to layers while considering preferable global routing topologies simultaneously. We take transmission line effects into account to avoid noise in high-speed circuit packages. The problem is formulated as a quadratic Boolean programming problem and an algorithm is presented to solve the problem after linearization. Our method is applied to a set of benchmark circuits to demonstrate the effectiveness.",

author = "Kai-Yuan Chao and Wong, {D. F.}",

note = "Funding Information: This work was partially supported by the Texas Advanced Research Program under Grant No. 003658459. Publisher Copyright: {\textcopyright} 1994 ACM ; 1994 IEEE/ACM International Conference on Computer-aided Design, ICCAD 1994 ; Conference date: 06-11-1994 Through 10-11-1994",

year = "1994",

month = nov,

doi = "10.1109/ICCAD.1994.629895",

language = "English",

isbn = "0818664177",

series = "Proceedings of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems",

publisher = "IEEE",

pages = "680--685",

booktitle = "1994 IEEE/ACM International Conference On Computer-aided Design, ICCAD 1994",

address = "United States",

url = "https://ieeexplore.ieee.org/xpl/conhome/4983/proceeding",

}

Chao, K-Y & Wong, DF 1994, Layer assignment for high-performance multi-chip modules. in 1994 IEEE/ACM International Conference On Computer-aided Design, ICCAD 1994. Proceedings of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE, pp. 680-685, 1994 IEEE/ACM International Conference on Computer-aided Design, ICCAD 1994, San Jose, California, United States, 6/11/94. https://doi.org/10.1109/ICCAD.1994.629895

Layer assignment for high-performance multi-chip modules. / Chao, Kai-Yuan; Wong, D. F.
1994 IEEE/ACM International Conference On Computer-aided Design, ICCAD 1994. IEEE, 1994. p. 680-685 (Proceedings of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems).

Research output: Chapter in book/report/conference proceeding › Chapter › peer-review

TY - CHAP

T1 - Layer assignment for high-performance multi-chip modules

AU - Chao, Kai-Yuan

AU - Wong, D. F.

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N2 - In this paper, we present a layer assignment method for high-performance multi-chip module environments. In contrast with treating global routing and layer assignment separately, our method assigns nets to layers while considering preferable global routing topologies simultaneously. We take transmission line effects into account to avoid noise in high-speed circuit packages. The problem is formulated as a quadratic Boolean programming problem and an algorithm is presented to solve the problem after linearization. Our method is applied to a set of benchmark circuits to demonstrate the effectiveness.

AB - In this paper, we present a layer assignment method for high-performance multi-chip module environments. In contrast with treating global routing and layer assignment separately, our method assigns nets to layers while considering preferable global routing topologies simultaneously. We take transmission line effects into account to avoid noise in high-speed circuit packages. The problem is formulated as a quadratic Boolean programming problem and an algorithm is presented to solve the problem after linearization. Our method is applied to a set of benchmark circuits to demonstrate the effectiveness.

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T3 - Proceedings of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

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BT - 1994 IEEE/ACM International Conference On Computer-aided Design, ICCAD 1994

PB - IEEE

T2 - 1994 IEEE/ACM International Conference on Computer-aided Design, ICCAD 1994

Y2 - 6 November 1994 through 10 November 1994

ER -

Layer assignment for high-performance multi-chip modules

Abstract

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Scopus Subject Areas

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