Efficient multi-die placement for blank defect mitigation in EUV lithography

Yuelin Du, Hongbo Zhang, Martin D.F. Wong, Yunfei Deng, Rasit O. Topaloglu

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

14 Citations (Scopus)

Abstract

Due to the absence of defect-free blanks in extreme ultraviolet (EUV) lithography, defect mitigation is necessary before mass production. One effective way to mitigate the defect impact is to increase the distance between the defects and feature boundaries such that the defects will not affect the printing of the features. Some algorithms have been developed to move the whole layout within the exposure field in order to avoid all defect impact. However, in reality the die size is usually much smaller than the exposure field, such that one blank is packed with multiple copies of the die, and each die can be placed independently within the exposure field. In this paper, we develop an EUV reticle placement algorithm to maximize the number of valid dies that are immune to defects. Given the layout of a die and a defective blank, we first apply a layout relocation algorithm to find all feasible regions for the die on the blank. Then we develop an efficient placement algorithm to place the dies within the feasible regions one at a time until all feasible regions are fully occupied. The simulation results show that our algorithm is able to find a solution efficiently and the number of valid dies placed by our algorithm is very close to the optimal solution.

Original languageEnglish
Title of host publicationExtreme Ultraviolet (EUV) Lithography III
EditorsPatrick P. Naulleau, Obert R. Wood II
PublisherSPIE
ISBN (Print)9780819489784
DOIs
Publication statusPublished - Feb 2012
EventExtreme Ultraviolet (EUV) Lithography III - San Jose, United States
Duration: 13 Feb 201216 Feb 2012
https://www.spiedigitallibrary.org/conference-proceedings-of-spie/8322.toc#FrontMatterVolume8322

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8322
ISSN (Print)0277-786X

Conference

ConferenceExtreme Ultraviolet (EUV) Lithography III
Country/TerritoryUnited States
CitySan Jose
Period13/02/1216/02/12
Internet address

Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

User-Defined Keywords

  • Blank defect mitigation
  • EUV
  • Multi-die placement

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