Dummy fill density analysis with coupling constraints

Hua Xiang, Liang Deng, Ruchir Puri, Kai-Yuan Chao, Martin D. F. Wong

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

18 Citations (Scopus)

Abstract

In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.

Original languageEnglish
Title of host publicationISPD '07
Subtitle of host publicationProceedings of the 2007 International Symposium on Physical Design
Pages3-10
Number of pages8
DOIs
Publication statusPublished - 18 Mar 2007
Event16th International Symposium on Physical Design, ISPD 2007 - Austin , United States
Duration: 18 Mar 200721 Mar 2007
https://dl.acm.org/doi/proceedings/10.1145/1231996 (Conference proceedings)

Publication series

NameProceedings of the International Symposium on Physical Design, ISPD

Symposium

Symposium16th International Symposium on Physical Design, ISPD 2007
Country/TerritoryUnited States
CityAustin
Period18/03/0721/03/07
Internet address

Scopus Subject Areas

  • Electrical and Electronic Engineering

User-Defined Keywords

  • dummy fills
  • coupling
  • CMP

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