Dummy fill density analysis with coupling constraints

Hua Xiang; Liang Deng; Ruchir Puri; Kai-Yuan Chao; Martin D. F. Wong

doi:10.1145/1231996.1232001

Dummy fill density analysis with coupling constraints

Hua Xiang, Liang Deng, Ruchir Puri, Kai-Yuan Chao, Martin D. F. Wong

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Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

19 Citations (Scopus)

Abstract

In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.

Original language	English
Title of host publication	ISPD '07
Subtitle of host publication	Proceedings of the 2007 International Symposium on Physical Design
Pages	3-10
Number of pages	8
DOIs	https://doi.org/10.1145/1231996.1232001
Publication status	Published - 18 Mar 2007
Event	16th International Symposium on Physical Design, ISPD 2007 - Austin , United States Duration: 18 Mar 2007 → 21 Mar 2007 https://dl.acm.org/doi/proceedings/10.1145/1231996 (Conference proceedings)

Publication series

Name	Proceedings of the International Symposium on Physical Design, ISPD

Symposium

Symposium	16th International Symposium on Physical Design, ISPD 2007
Country/Territory	United States
City	Austin
Period	18/03/07 → 21/03/07
Internet address	https://dl.acm.org/doi/proceedings/10.1145/1231996 (Conference proceedings)

Scopus Subject Areas

Electrical and Electronic Engineering

User-Defined Keywords

dummy fills
coupling
CMP

Access to Document

10.1145/1231996.1232001

Cite this

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title = "Dummy fill density analysis with coupling constraints",

abstract = "In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.",

keywords = "dummy fills, coupling, CMP",

author = "Hua Xiang and Liang Deng and Ruchir Puri and Kai-Yuan Chao and Wong, {Martin D. F.}",

year = "2007",

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Xiang, H, Deng, L, Puri, R, Chao, K-Y & Wong, MDF 2007, Dummy fill density analysis with coupling constraints. in ISPD '07: Proceedings of the 2007 International Symposium on Physical Design. Proceedings of the International Symposium on Physical Design, ISPD, pp. 3-10, 16th International Symposium on Physical Design, ISPD 2007, Austin , Texas, United States, 18/03/07. https://doi.org/10.1145/1231996.1232001

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AU - Xiang, Hua

AU - Deng, Liang

AU - Puri, Ruchir

AU - Chao, Kai-Yuan

AU - Wong, Martin D. F.

PY - 2007/3/18

Y1 - 2007/3/18

N2 - In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.

AB - In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.

KW - dummy fills

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Dummy fill density analysis with coupling constraints

Abstract

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Symposium

Scopus Subject Areas

User-Defined Keywords

Access to Document

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