TY - JOUR
T1 - Dielectric Metasurfaces Enabled Ultradensely Integrated Multidimensional Optical System
AU - Zhou, Hailong
AU - Wang, Yilun
AU - Gao, Xiaoyan
AU - Gao, Dingshan
AU - Dong, Jianji
AU - Huang, Dongmei
AU - Li, Feng
AU - Wai, Ping kong Alexander
AU - Zhang, Xinliang
N1 - National Key Research and Development Project of China. Grant Numbers: 2018YFB2201901, 2019YFB2203102
National Natural Science Foundation of China. Grant Numbers: 61805090, 62075075, 61927817, 61735006
Shenzhen Science and Technology Innovation Commission. Grant Number: SGDX2019081623060558
Research Grants Council, University Grants Committee of Hong Kong SAR. Grant Number: PolyU152241/18E
Publisher Copyright:
© 2022 Wiley-VCH GmbH.
PY - 2022/4
Y1 - 2022/4
N2 - Metasurfaces consisted of subwavelength nanostructures can extremely interact with light and manipulate the characteristics of amplitude, phase, and polarization. In particular, on-chip dielectric metasurfaces have attracted significant attention for optical communication and computing, due to its compact footprint, low loss, and broad bandwidth. Herein, an ultradensely integrated multidimensional optical system with a footprint of only 20 × 30 µm2 based on inverse-designed dielectric metasurface network, incorporating mode-division multiplexing, and coherent optical communication technologies that can multiply the system capacity is demonstrated. It is assembled by the ultracompact multifunction on-chip metasurface devices, including four-mode demultiplexer, optical hybrid, crossing, and bending, which all have a size of only several micrometers. The inverse-designed work can significantly broaden the integrated device applications of on-chip metasurfaces and pave an alternative way for large-scale high-capacity optical communication system.
AB - Metasurfaces consisted of subwavelength nanostructures can extremely interact with light and manipulate the characteristics of amplitude, phase, and polarization. In particular, on-chip dielectric metasurfaces have attracted significant attention for optical communication and computing, due to its compact footprint, low loss, and broad bandwidth. Herein, an ultradensely integrated multidimensional optical system with a footprint of only 20 × 30 µm2 based on inverse-designed dielectric metasurface network, incorporating mode-division multiplexing, and coherent optical communication technologies that can multiply the system capacity is demonstrated. It is assembled by the ultracompact multifunction on-chip metasurface devices, including four-mode demultiplexer, optical hybrid, crossing, and bending, which all have a size of only several micrometers. The inverse-designed work can significantly broaden the integrated device applications of on-chip metasurfaces and pave an alternative way for large-scale high-capacity optical communication system.
KW - coherent optical communication
KW - dielectric metasurfaces
KW - mode-division multiplexing
KW - optical hybrid
KW - silicon photonics
UR - http://www.scopus.com/inward/record.url?scp=85123943740&partnerID=8YFLogxK
U2 - 10.1002/lpor.202100521
DO - 10.1002/lpor.202100521
M3 - Journal article
AN - SCOPUS:85123943740
SN - 1863-8880
VL - 16
JO - Laser and Photonics Reviews
JF - Laser and Photonics Reviews
IS - 4
M1 - 2100521
ER -