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CU.POKer: Placing DNNs on Wafer-Scale Al Accelerator with Optimal Kernel Sizing

  • Bentian Jiang
  • , Jingsong Chen
  • , Jinwei Liu
  • , Lixin Liu
  • , Fangzhou Wang
  • , Xiaopeng Zhang
  • , Evangeline F.Y. Young

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

10 Citations (Scopus)

Abstract

The tremendous growth in deep learning (DL) applications has created an exponential demand for computing power, which leads to the rise of AI-specific hardware. Targeted towards accelerating computation-intensive deep learning applications, AI hardware, including but not limited to GPGPU, TPU, ASICs, etc., have been adopted ubiquitously. As a result, domain-specific CAD tools play more and more important roles and have been deeply involved in both the design and compilation stages of modern AI hardware. Recently, ISPD 2020 contest introduced a special challenge targeting at the physical mapping of neural network workloads onto the largest commercial deep learning accelerator, CS-1 Wafer-Scale Engine (WSE). In this paper, we proposed CU.POKer, a high-performance engine fully-customized for WSE's DNN workload placement challenge. A provably optimal placeable kernel candidate searching scheme and a data-flow-aware placement tool are developed accordingly to ensure the state-of-the-art quality on the real industrial benchmarks. Experimental results on ISPD 2020 contest evaluation suites [1] demonstrated the superiority of our proposed framework over other contestants.

Original languageEnglish
Title of host publicationICCAD '20: Proceedings of the 39th International Conference on Computer-Aided Design
Place of PublicationNew York
PublisherAssociation for Computing Machinery (ACM)
Chapter142
Number of pages10
ISBN (Print)9781450380263
DOIs
Publication statusPublished - 2 Nov 2020
Event39th IEEE/ACM International Conference on Computer-Aided Design - Virtual, San Diego, United States
Duration: 2 Nov 20205 Nov 2020
https://dl.acm.org/doi/proceedings/10.1145/3400302?id=121 (Conference proceeding)

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Conference

Conference39th IEEE/ACM International Conference on Computer-Aided Design
Abbreviated titleICCAD 2020
Country/TerritoryUnited States
CitySan Diego
Period2/11/205/11/20
Internet address

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

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