Coupling-aware mixed dummy metal insertion for lithography

Liang Deng; Martin D.F. Wong; Kai Yuan Chao; Hua Xiang

doi:10.1117/12.711644

Coupling-aware mixed dummy metal insertion for lithography

Liang Deng, Martin D.F. Wong, Kai Yuan Chao, Hua Xiang

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

3 Citations (Scopus)

Abstract

As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called off-axis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.

Original language	English
Title of host publication	Design for Manufacturability through Design-Process Integration
Editors	Alfred K. K. Wong , Vivek K. Singh
Publisher	SPIE
ISBN (Print)	0819466409, 9780819466402
DOIs	https://doi.org/10.1117/12.711644
Publication status	Published - Mar 2007
Event	Design for Manufacturability through Design-Process Integration - San Jose, United States Duration: 28 Feb 2007 → 2 Mar 2007 https://www.spiedigitallibrary.org/conference-proceedings-of-spie/6521.toc

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6521
ISSN (Print)	0277-786X

Conference

Conference	Design for Manufacturability through Design-Process Integration
Country/Territory	United States
City	San Jose
Period	28/02/07 → 2/03/07
Internet address	https://www.spiedigitallibrary.org/conference-proceedings-of-spie/6521.toc

Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

User-Defined Keywords

Assist feature
Coupling capacitance
Lithography cost
RET
SPAF

Access to Document

10.1117/12.711644

Cite this

@inproceedings{2419912bfb9f43cdb8a24bf86bf4ed41,

title = "Coupling-aware mixed dummy metal insertion for lithography",

abstract = "As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called off-axis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.",

keywords = "Assist feature, Coupling capacitance, Lithography cost, RET, SPAF",

author = "Liang Deng and Wong, {Martin D.F.} and Chao, {Kai Yuan} and Hua Xiang",

year = "2007",

month = mar,

doi = "10.1117/12.711644",

language = "English",

isbn = "0819466409",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

editor = "{Wong }, {Alfred K. K.} and Singh, {Vivek K.}",

booktitle = "Design for Manufacturability through Design-Process Integration",

address = "United States",

note = "Design for Manufacturability through Design-Process Integration ; Conference date: 28-02-2007 Through 02-03-2007",

url = "https://www.spiedigitallibrary.org/conference-proceedings-of-spie/6521.toc",

}

Deng, L, Wong, MDF, Chao, KY & Xiang, H 2007, Coupling-aware mixed dummy metal insertion for lithography. in AKK Wong & VK Singh (eds), Design for Manufacturability through Design-Process Integration., 65210H, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6521, SPIE, Design for Manufacturability through Design-Process Integration, San Jose, California, United States, 28/02/07. https://doi.org/10.1117/12.711644

Coupling-aware mixed dummy metal insertion for lithography. / Deng, Liang; Wong, Martin D.F.; Chao, Kai Yuan et al.
Design for Manufacturability through Design-Process Integration. ed. / Alfred K. K. Wong ; Vivek K. Singh. SPIE, 2007. 65210H (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6521).

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

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T1 - Coupling-aware mixed dummy metal insertion for lithography

AU - Deng, Liang

AU - Wong, Martin D.F.

AU - Chao, Kai Yuan

AU - Xiang, Hua

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N2 - As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called off-axis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.

AB - As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RET) are needed to correctly manufacture a chip design. The widely used RET called off-axis illumination (OAI) introduces forbidden pitches which lead to very complex design rules. It has been observed that imposing uniformity on layout designs can substantially improve printability under OAI. In this paper, two types of assist features for the metal layer are proposed to improve the uniformity, printable assist feature and segmented printable assist feature. They bring different costs on performance and manufacturing. Coupling and lithography costs from these assist features are discussed. Optimal insertion algorithm is proposed to use both types of dummy metals, considering trade-offs between coupling and lithography costs.

KW - Assist feature

KW - Coupling capacitance

KW - Lithography cost

KW - RET

KW - SPAF

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Coupling-aware mixed dummy metal insertion for lithography

Abstract

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Scopus Subject Areas

User-Defined Keywords

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