Copper and nickel uptake, accumulation and tolerance in Typha latifolia with and without iron plaque on the root surface

Z. H. Ye, A. J.M. Baker*, Ming Hung WONG, A. J. Willis

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

116 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Copper and nickel uptake, accumulation and tolerance in Typha latifolia with and without iron plaque on the root surface'. Together they form a unique fingerprint.

Medicine & Life Sciences

Agriculture & Biology