Copper and nickel uptake, accumulation and tolerance in Typha latifolia with and without iron plaque on the root surface

Z. H. Ye, A. J.M. Baker*, Ming Hung WONG, A. J. Willis

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

116 Citations (Scopus)

Abstract

The effects of iron plaque on the growth of Typha latifolia L. and accumulation of copper and nickel in T. latifolia were investigated under laboratory conditions in nutrient solution cultures. Seedlings with and without iron plaque on their roots were exposed to 0.05 μg ml-1 Cu and 0.10 μg ml-1 Ni solutions for 72 d. The results showed no differences in root and shoot d. wt and leaf elongation when Cu or Ni were added to the solution and in the presence or absence of plaque. However, root length was reduced by Cu and Ni, and the reduction in root length was greater in the presence of plaque. Some Cu and Ni was adsorbed on root surfaces; roots with plaque took up more Cu, but less Ni than those without. The presence of plaque did not alter Cu uptake and translocation but increased Ni uptake and translocation. Most of the Cu and Ni taken up was retained in the roots, suggesting that the root tissue rather than the root surface or plaque is the main barrier for Cu and Ni transport. The results differ from those reported for other species.

Original languageEnglish
Pages (from-to)481-488
Number of pages8
JournalNew Phytologist
Volume136
Issue number3
DOIs
Publication statusPublished - 1997

Scopus Subject Areas

  • Physiology
  • Plant Science

User-Defined Keywords

  • Copper uptake
  • Iron plaque
  • Metal tolerance
  • Nickel uptake
  • Typha latifolia

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