Cell-based OPC with standard-cell fill insertion

Liang Deng*, Kai Yuan Chao, Hua Xiang, Martin D.F. Wong

*Corresponding author for this work

Research output: Chapter in book/report/conference proceedingConference proceedingpeer-review

2 Citations (Scopus)


Litho-aware design methodology is the key to enable the aggressive scaling down to the future technology node. Boundary based methodology for cellwise OPC has been proposed to account for influence from features of neighboring cells. As technology advances toward 32 and 22 nm, more columns of features are needed as representative environments for the boundary-based cellwise OPC. In this paper, we propose a new method that combines the fill insertion and boundary-based cellwise OPC to reduce the mask data size as well as the prohibitive runtime of full-chip OPC, making cell characterization more predictable. To make the number of cell OPC solutions easy to handle, we present a new methodology which uses dummy fill insertion both inside and outside cells to solve the issue for technologies beyond 45 nm. Experimental results show a solid 30% improvement on average and maximum edge placement errors (EPE) over the previous work.

Original languageEnglish
Title of host publicationDesign for Manufacturability through Design-Process Integration II
EditorsVivek K. Singh , Michael L. Rieger
ISBN (Print)9780819471109
Publication statusPublished - Feb 2008
EventDesign for Manufacturability through Design-Process Integration II - San Jose, United States
Duration: 28 Feb 200829 Feb 2008

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


ConferenceDesign for Manufacturability through Design-Process Integration II
Country/TerritoryUnited States
CitySan Jose
Internet address

Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

User-Defined Keywords

  • Cellwise OPC
  • Design for manufacturing
  • Fill insertion
  • Lithography


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