TY - JOUR
T1 - Aqueous and air-compatible fabrication of high-performance conductive textiles
AU - Wang, Xiaolong
AU - Yan, Casey
AU - Hu, Hong
AU - Zhou, Xuechang
AU - Guo, Ruisheng
AU - Liu, Xuqing
AU - Xie, Zhuang
AU - HUANG, Jeffery
AU - Zheng, Zijian
N1 - Copyright:
Copyright 2019 Elsevier B.V., All rights reserved.
PY - 2014/8
Y1 - 2014/8
N2 - This paper describes a fully aqueous- and air-compatible chemical approach to preparing high-performance conductive textiles. In this method, the surfaces of textile materials are first modified with an aqueous solution of double-bond-containing silane molecules to form a surface-anchoring layer for subsequent in situ free-radical polymerization of [2-(methacryloyloxy)ethyl]trimethylammonium chloride (METAC) in the air. Thin layers of poly-METAC (PMETAC) are therefore covalently grafted on top of the silane-modified textile surface. Cu- or Ni-coated textiles are finally fabricated by electroless deposition (ELD) onto the PMETAC-modified textiles. Parameters including polymerization time, temperature, and ELD conditions are studied to optimize the whole fabrication process. The as-made conductive textiles exhibit sheet resistance as low as 0.2 Ωsq-1, which makes them highly suitable for use as conductive wires and interconnects in flexible and wearable electronic devices. More importantly, the chemical method is fully compatible with the conventional "pad-dry-cure" fabrication process in the textile manufacturing industry, thus indicating that it is very promising for high-throughput and roll-to-roll fabrication of high-performance metal-coated conductive textiles in the future.
AB - This paper describes a fully aqueous- and air-compatible chemical approach to preparing high-performance conductive textiles. In this method, the surfaces of textile materials are first modified with an aqueous solution of double-bond-containing silane molecules to form a surface-anchoring layer for subsequent in situ free-radical polymerization of [2-(methacryloyloxy)ethyl]trimethylammonium chloride (METAC) in the air. Thin layers of poly-METAC (PMETAC) are therefore covalently grafted on top of the silane-modified textile surface. Cu- or Ni-coated textiles are finally fabricated by electroless deposition (ELD) onto the PMETAC-modified textiles. Parameters including polymerization time, temperature, and ELD conditions are studied to optimize the whole fabrication process. The as-made conductive textiles exhibit sheet resistance as low as 0.2 Ωsq-1, which makes them highly suitable for use as conductive wires and interconnects in flexible and wearable electronic devices. More importantly, the chemical method is fully compatible with the conventional "pad-dry-cure" fabrication process in the textile manufacturing industry, thus indicating that it is very promising for high-throughput and roll-to-roll fabrication of high-performance metal-coated conductive textiles in the future.
KW - conducting materials
KW - electroless deposition
KW - polymerization
KW - radicals
KW - wearable electronics
UR - http://www.scopus.com/inward/record.url?scp=84905216171&partnerID=8YFLogxK
U2 - 10.1002/asia.201402230
DO - 10.1002/asia.201402230
M3 - Journal article
AN - SCOPUS:84905216171
SN - 1861-4728
VL - 9
SP - 2170
EP - 2177
JO - Chemistry - An Asian Journal
JF - Chemistry - An Asian Journal
IS - 8
ER -