Abstract
In the deep submicron manufacturing (DSM) era, lithography/yield and noise are critical issues to be considered. Optical proximity correction (OPC) is becoming a key compensate technique for the light diffraction effect in lithography. Both OPC effect and the capacitive coupling on some wire segments can only be analyzed post routing in late design stage or post-silicon stepping design change. ECO (engineering change orders) is used in late design stage to fix violations that exceed the given OPC and coupling capacitance thresholds derived from analysis. These violations must be corrected in order to guarantee performance and yield. In this paper, we propose the first ECO routing algorithm which eliminates both OPC and coupling capacitance violations for wires. At the same time, the ECO routing obeys the given constraints so as to keep the new routing solution close to the existing one to preserve design timing and layout convergence
Original language | English |
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Title of host publication | 2005 6th International Conference on ASIC Proceedings, ASICON 2005 |
Editors | Ting Ao Tang, Yumei Huang |
Place of Publication | China |
Publisher | IEEE |
Pages | 784-787 |
Number of pages | 4 |
Volume | 2 |
DOIs | |
Publication status | Published - Oct 2005 |
Event | 2005 6th International Conference on ASIC, ASICON 2005 - Shanghai, China Duration: 24 Oct 2005 → 27 Oct 2005 https://ieeexplore.ieee.org/xpl/conhome/10726/proceeding (Link to conference proceedings) |
Publication series
Name | International Conference on ASIC Proceeding |
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ISSN (Print) | 2162-7541 |
ISSN (Electronic) | 2162-755X |
Conference
Conference | 2005 6th International Conference on ASIC, ASICON 2005 |
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Country/Territory | China |
City | Shanghai |
Period | 24/10/05 → 27/10/05 |
Internet address |
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