Advances in CAD for low power design

Martin D.F. Wong

doi:10.1109/ASICON.2009.5351282

Advances in CAD for low power design

Martin D.F. Wong

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

Abstract

High Power consumption not only leads to short battery life for mobile devices, but also causes on-chip thermal and reliability problems. In this talk, we present some of our recent results in CAD for low power design.

Original language	English
Title of host publication	ASICON 2009 - Proceedings, 2009 8th IEEE International Conference on ASIC
Publisher	IEEE
Pages	780
Number of pages	1
ISBN (Electronic)	9781424438709
ISBN (Print)	9781424438686, 9781424438693
DOIs	https://doi.org/10.1109/ASICON.2009.5351282
Publication status	Published - Oct 2009
Event	2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha, China Duration: 20 Oct 2009 → 23 Oct 2009 https://ieeexplore.ieee.org/xpl/conhome/5341889/proceeding

Publication series

Name	Proceedings of IEEE International Conference on ASIC
ISSN (Print)	2162-7541
ISSN (Electronic)	2162-755X

Conference

Conference	2009 8th IEEE International Conference on ASIC, ASICON 2009
Country/Territory	China
City	Changsha
Period	20/10/09 → 23/10/09
Internet address	https://ieeexplore.ieee.org/xpl/conhome/5341889/proceeding

User-Defined Keywords

Glitch-aware routing
Low power
Manufacturing for design
Wire shaping

Access to Document

10.1109/ASICON.2009.5351282

Cite this

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title = "Advances in CAD for low power design",

abstract = "High Power consumption not only leads to short battery life for mobile devices, but also causes on-chip thermal and reliability problems. In this talk, we present some of our recent results in CAD for low power design.",

keywords = "Glitch-aware routing, Low power, Manufacturing for design, Wire shaping",

author = "Wong, \{Martin D.F.\}",

year = "2009",

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doi = "10.1109/ASICON.2009.5351282",

language = "English",

isbn = "9781424438686",

series = "Proceedings of IEEE International Conference on ASIC",

publisher = "IEEE",

pages = "780",

booktitle = "ASICON 2009 - Proceedings, 2009 8th IEEE International Conference on ASIC",

address = "United States",

note = "2009 8th IEEE International Conference on ASIC, ASICON 2009 ; Conference date: 20-10-2009 Through 23-10-2009",

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AB - High Power consumption not only leads to short battery life for mobile devices, but also causes on-chip thermal and reliability problems. In this talk, we present some of our recent results in CAD for low power design.

KW - Glitch-aware routing

KW - Low power

KW - Manufacturing for design

KW - Wire shaping

UR - https://www.scopus.com/pages/publications/77949378415

U2 - 10.1109/ASICON.2009.5351282

DO - 10.1109/ASICON.2009.5351282

M3 - Conference proceeding

AN - SCOPUS:77949378415

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SN - 9781424438693

T3 - Proceedings of IEEE International Conference on ASIC

SP - 780

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PB - IEEE

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ER -

Advances in CAD for low power design

Abstract

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User-Defined Keywords

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