Abstract
High Power consumption not only leads to short battery life for mobile devices, but also causes on-chip thermal and reliability problems. In this talk, we present some of our recent results in CAD for low power design.
Original language | English |
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Title of host publication | ASICON 2009 - Proceedings, 2009 8th IEEE International Conference on ASIC |
Publisher | IEEE |
Pages | 780 |
Number of pages | 1 |
ISBN (Electronic) | 9781424438709 |
ISBN (Print) | 9781424438686, 9781424438693 |
DOIs | |
Publication status | Published - Oct 2009 |
Event | 2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha, China Duration: 20 Oct 2009 → 23 Oct 2009 https://ieeexplore.ieee.org/xpl/conhome/5341889/proceeding |
Publication series
Name | Proceedings of IEEE International Conference on ASIC |
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ISSN (Print) | 2162-7541 |
ISSN (Electronic) | 2162-755X |
Conference
Conference | 2009 8th IEEE International Conference on ASIC, ASICON 2009 |
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Country/Territory | China |
City | Changsha |
Period | 20/10/09 → 23/10/09 |
Internet address |
Scopus Subject Areas
- Hardware and Architecture
- Electrical and Electronic Engineering
User-Defined Keywords
- Glitch-aware routing
- Low power
- Manufacturing for design
- Wire shaping