A Practical Low-Power Nonregular Interconnect Design With Manufacturing for Design Approach

Hongbo Zhang*, Martin D.F. Wong, Kai Yuan Chao, Liang Deng

*Corresponding author for this work

Research output: Contribution to journalJournal articlepeer-review

4 Citations (Scopus)


Wire shaping for delay/power minimization has been extensively studied. Due to the perceived high design and manufacturing costs for using nonregular wire shapes, wire shaping is generally considered to be impractical. In this paper, we present a practical wire shaping method to reduce power consumption of interconnect. Nonregular wire shapes are directly implemented on silicon wafer instead of in GDSII during design. We present novel enhancements to existing optical proximity correction (OPC) technology to accurately print nonregular wire shapes. Experimental results show that the post-OPC mask complexities of uniform wire and nonregular wire are comparable. With minimal impact on the design and manufacturing flows and minimal additional design and manufacturing costs, we demonstrate that wire shaping can help to obtain substantial reduction of interconnect dynamic power without affecting timing closure. Our wire shaping methodology is an excellent example of Manufacturing for Design.
Original languageEnglish
Article number6198293
Pages (from-to)322-332
Number of pages11
JournalIEEE Journal on Emerging and Selected Topics in Circuits and Systems
Issue number2
Publication statusPublished - Jun 2012

Scopus Subject Areas

  • Electrical and Electronic Engineering

User-Defined Keywords

  • Interconnect
  • manufacturing for design
  • optical proximity correction (OPC)
  • power minimization
  • wire tapering


Dive into the research topics of 'A Practical Low-Power Nonregular Interconnect Design With Manufacturing for Design Approach'. Together they form a unique fingerprint.

Cite this