3D floorplan design

Martin D. F. Wong

doi:10.1109/ICCCAS.2009.5250322

3D floorplan design

Martin D. F. Wong

Office of the Provost

Research output: Chapter in book/report/conference proceeding › Conference proceeding › peer-review

Abstract

This talk focuses on the floorplan design problem for 3D ICs. The traditional 2D floorplan design problem has been extensively studied in the past 30 years. We first give a brief overview of the history of 2D floorplan design. We then point out some lessons that we can learn from these prior research efforts which potentially will benefit research in 3D floorplan design.

Original language	English
Title of host publication	2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009
Publisher	IEEE
Pages	1097-1097
Number of pages	1
ISBN (Print)	9781424448869
DOIs	https://doi.org/10.1109/ICCCAS.2009.5250322
Publication status	Published - 25 Jul 2009
Event	2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009 - Milpitas, California, United States Duration: 23 Jul 2009 → 25 Jul 2009 https://ieeexplore.ieee.org/xpl/conhome/5230905/proceeding

Publication series

Name	International Conference on Communications, Circuits and Systems - Proceedings
Publisher	IEEE

Conference

Conference	2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009
Country/Territory	United States
City	California
Period	23/07/09 → 25/07/09
Internet address	https://ieeexplore.ieee.org/xpl/conhome/5230905/proceeding

Access to Document

10.1109/ICCCAS.2009.5250322

Cite this

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title = "3D floorplan design",

abstract = "This talk focuses on the floorplan design problem for 3D ICs. The traditional 2D floorplan design problem has been extensively studied in the past 30 years. We first give a brief overview of the history of 2D floorplan design. We then point out some lessons that we can learn from these prior research efforts which potentially will benefit research in 3D floorplan design.",

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year = "2009",

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doi = "10.1109/ICCCAS.2009.5250322",

language = "English",

isbn = "9781424448869",

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address = "United States",

note = "2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009 ; Conference date: 23-07-2009 Through 25-07-2009",

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Wong, MDF 2009, 3D floorplan design. in 2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009. International Conference on Communications, Circuits and Systems - Proceedings, IEEE, pp. 1097-1097, 2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009, California, California, United States, 23/07/09. https://doi.org/10.1109/ICCCAS.2009.5250322

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N2 - This talk focuses on the floorplan design problem for 3D ICs. The traditional 2D floorplan design problem has been extensively studied in the past 30 years. We first give a brief overview of the history of 2D floorplan design. We then point out some lessons that we can learn from these prior research efforts which potentially will benefit research in 3D floorplan design.

AB - This talk focuses on the floorplan design problem for 3D ICs. The traditional 2D floorplan design problem has been extensively studied in the past 30 years. We first give a brief overview of the history of 2D floorplan design. We then point out some lessons that we can learn from these prior research efforts which potentially will benefit research in 3D floorplan design.

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U2 - 10.1109/ICCCAS.2009.5250322

DO - 10.1109/ICCCAS.2009.5250322

M3 - Conference proceeding

SN - 9781424448869

T3 - International Conference on Communications, Circuits and Systems - Proceedings

SP - 1097

EP - 1097

BT - 2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009

PB - IEEE

T2 - 2009 International Conference on Communications, Circuits and Systems, ICCCAS 2009

Y2 - 23 July 2009 through 25 July 2009

ER -

3D floorplan design

Abstract

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